Innovation in Printed Electronics – Insights from LOPEC

The future of electronics is lighter, more flexible, and increasingly printed.

At LOPEC 2026, the momentum across the industry was clear — with rapid advancements in flexible circuits, sensors, and energy devices driving demand for high-performance conductive materials.

At Ames Goldsmith, we support these developments with a comprehensive silver-based portfolio:

Silver flake – optimised for conductivity and ink formulation
Silver powder – controlled morphology for precision applications
Silver-copper (AgCu) – enabling cost-effective performance at scale

Our focus is simple: deliver reliable materials that translate into real-world performance.

Watch the video here for a snapshot of the event and where the market is heading.

Ames Goldsmith Corporation